
AR
HIVE INF
RMATI
N
PRODUCT TRANSFERRED TO M/A–COM
AN758
13
RF Application Reports
°
η
Figure 21. Heat Sink Temperature versus Time
Figure 22. Output Harmonic Contents versus
Frequency
µ
µ
Figure 23. Load Mismatch Test Circuit
NOTE: Not to scale.
Figure 24. Circuit Board Layout of the Power Combiner Assembly
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